Professional BGA Re-work Services in Portsmouth

Precision BGA removal, replacement and repair handled with care, accuracy and controlled thermal expertise.

Phase One Electronics provides specialist Ball Grid Array (BGA) re-work for UK businesses that require safe, reliable and technically controlled removal, replacement and repair. With over 35 years of experience, we re-work BGAs without damaging the PCB, surrounding components or internal board layers offering a cost-effective alternative to scrapping valuable assemblies.

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Why Choose Phase One Electronics for BGA Re-work?

BGA re-work is one of the most delicate procedures in electronics manufacturing. It requires exceptional thermal control, precise alignment and highly trained technicians. Our facility, tools and expertise are specifically developed to safely handle complex BGA repairs, removals and replacements.

Skilled Technicians with Decades of Experience

Our team has worked with BGA devices since their early adoption, giving us deep understanding of thermal behaviour, soldering limits and how to prevent PCB damage.

Clean, Repeatable and Carefully Monitored Processes

Every step is monitored to ensure precise removal, cleaning, alignment and reflow delivering consistent, high-quality joints every time.

Controlled Thermal Profiles and Professional Re-work Equipment

We use accurate, computer-controlled re-work stations engineered for safe BGA removal and replacement, ensuring controlled heating, clean solder collapse and repeatable results.

Ideal for Prototypes, Repairs and Production-Level Re-work

From one-off prototypes to batch repairs, we support all re-work needs and help extend the life of valuable assemblies.

Guaranteed Protection of Surrounding Components

Thermal shields, precise nozzles and controlled airflow protect nearby components, preventing heat damage, warping or stress to the PCB.

Full UK-Based Re-work Facility

All BGA re-work is carried out here in Portsmouth no outsourcing, no overseas risks, no shipping delays.

Our Complete BGA Re-work Process

Our BGA re-work procedure has been refined over decades to ensure safe, controlled and repeatable results. Every step is performed by trained technicians using dedicated re-work equipment designed to protect your PCB, maintain pad integrity and deliver reliable solder joints.

Initial Assessment and Feasibility Review

We examine the PCB, the BGA package and surrounding components to determine suitability for re-work. This includes checking board condition, pad integrity, thermal behaviour and customer requirements.

Controlled Heating and BGA Removal

Using top and bottom heaters, we apply a precise, computer-controlled thermal profile. The BGA is lifted cleanly using vacuum tools without prying or stressing the PCB.

Pad Cleaning and Preparation

We clean residual solder, inspect for lifted pads, confirm solder mask integrity and ensure the pad surface is flat and suitable for re-installation.

Component Alignment and Placement

Using optical alignment systems and precision nozzles, we centre the BGA so each ball aligns perfectly with its pad. Even slight misalignment can create hidden faults.

Reflow Soldering with Controlled Thermal Profiles

A tailored reflow profile ensures proper ball collapse, strong solder joints and even heat distribution—avoiding overheating or thermal shock.

Post-Reflow Inspection and Verification

We verify joint formation using package height checks, alignment confirmation, magnification tools and optional X-ray inspection for enhanced assurance.

Electrical Testing and Functional Checks

Continuity testing, power-on tests, signal checks or full functional testing can be performed to confirm that the re-worked assembly operates correctly.

Industries That Rely on Our BGA Re-work Expertise

BGA technology is widely used across advanced and high-reliability applications. Because BGA failure can result in costly downtime or unsafe operation, our re-work service is trusted by industries that require consistent performance, stable operation and precision repair capability.

Marine &
Offshore

Electronics that must withstand corrosion, moisture, vibration and long-term exposure to harsh environments.

Defence &
Military

Reliable, secure, safety-critical circuits designed for mission-ready performance and strict quality standards.

Automotive &
Electric Vehicles

Electronics exposed to constant vibration, heat cycling and extended operating lifetimes.

Medical &
Healthcare Equipment

Safety-critical systems that require complete stability, cleanliness and predictable long-term operation.

Telecommunications &
Surveillance

Electronics that must deliver signal integrity, uptime and reliable data processing in varied environments.

Industrial Automation &
Robotics

Precision control systems used in 24/7 environments where failure is unacceptable.

Rail, Transport &
Infrastructure

Durable electronics designed for heavy-duty, mission-critical applications in transport and public infrastructure.

Audio & Music Industry

Group of people at a sound mixer station

Electronics used in live sound, studio recording and broadcast environments, requiring ultra-low noise performance, stable signal processing and long-term reliability under continuous operation.

Supporting All Types of BGA Packages

Our re-work facility handles a wide range of BGA formats, from compact micro-devices to large, high-pin-count processors. Whether your assembly requires simple removal or complete replacement, our technicians work with the precision and thermal control these devices demand.

PBGA (Plastic Ball Grid Array)

Common across commercial, automotive and industrial systems — offering good thermal performance and flexibility.

Micro-BGA / Fine-Pitch BGA

Very small devices with tight pitch requirements — ideal for compact consumer or embedded electronics.

FPGA and Processor-Grade BGAs

Large, complex packages used in computing, telecoms, defence and aerospace — requiring careful handling and customised reflow profiles.

CSP (Chip-Scale Packages)

Highly miniaturised packages requiring exceptional accuracy and precise thermal control during re-work.

CBGA (Ceramic Ball Grid Array)

Used in high-performance, high-temperature and defence-grade electronics, requiring controlled heating during re-work.

eMMC, Flash Memory & Storage BGAs

Common in embedded systems and consumer devices — often replaced during upgrades, repairs or data-related maintenance.

LGA (Land Grid Array)

Pad-based packages that require perfectly flat surfaces and accurate placement for reliable electrical connection.

Request a BGA Re-work Quote

To provide an accurate quotation for BGA removal, replacement or re-work, please send us the details of your project. We respond quickly with clear pricing, expert guidance and reliable turnaround expectations.

PCB or High-Quality Photo

A clear image or the physical PCB helps us assess feasibility, risk level and the surrounding layout.

BGA Part Number

We confirm compatibility, thermal profile requirements and any handling precautions associated with the device.

Quantity Required

From single PCB repairs to ongoing batches, we tailor pricing to match your volume and requirements.

Required Turnaround Time

Let us know your deadlines or whether the work forms part of an urgent repair or engineering change.

Description of the Issue

Tell us whether the BGA has failed, was misaligned, needs upgrading or requires complete removal and replacement.

Are You Supplying the Replacement BGA?

We can work with customer-supplied parts or adjust our handling for turnkey sourcing requirements.

Any Testing or Verification Needed

We can perform continuity testing, power-up checks or customer-defined functional testing where required.

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